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Compound Photonic Devices, Integration, and Packaging

  • In colloabration with WIN (the local foundry), the high-power lasers capable of >200 mW output power is successfully demonstrated.
    [S. Sulikhah et al., in Proc. OFC2024, W2A.18 (2024).]
  • Electronic circuits for 56Gb/s transmission are designed.
  • Tenser processing circuits for high-performance computing are developed.
  • Photonic wire bonding technoloiges based on two-photon polymerization are developed for hetergenous chip integration.
  • A fabrication platform for GaN-on-Si device is built. By directly integrating the photo-receivers with the LEDs, we demonstrate constant LED output power by dynamiacally adjusting the LED current according to the monitored feedback signals.
    [Y.-T. Chang et al., in Proc. CLEO 2023, JTu2A.58 (2023).]

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