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Goal

 

The goal of the center (HiSiPIC) is to establish a world-class development platform of the photonic integrated circuits (PICs) and serve as a catalyst for advancing the optoelectronic chip industry so that promoting Taiwan Government policies for research and development (R&D) in optoelectronic chip technology, supporting industrial development, integrating industry-academia-research resources, maintaining the leadership in semiconductor industry, and raising the country’s international visibility.
So far, various important technologies for photonic integrated circuits have been developed, however, an integrated platform capable of fulfilling diverse system requirements has yet to be established. According to this consideration, the establishment of the “Heterogeneously-integrated Silicon Photonic Integration Center (HiSiPIC)” is aimed at leveraging the fundamental silicon photonics technologies to collaborate with industry and research institutions to explore platforms for heterogeneously-integrating key components such as electronic chips and silicon carbide (SiC) and indium phosphide (InP) related devices. This center will provide photonic chip layout design and tape-out service and talent education and training, thereby helping to develop new national strategic technologies and injecting fresh energy into Taiwan’s semiconductor industry.

The key directions of HiSiPIC include:

  • To conduct cutting-edge R&D in various PIC design, integration, testing, and application-related technologies through the platform; to demonstrate innovative results to attract more resources from industry, government, academia, and research institutions, thereby driving the development of optoelectronic chip industry.
  • To assist national policies and industrial planning in PIC industry: utilizing the platform for preliminary concept verifications and tests to provide reference for government policies and find new blue ocean for the optoelectronic industry.
  • To provide support for industry and academia in the development of PIC technologies through technology transfer and consultation. Additionally, to conduct related resource integration and industry guidance to develop the optoelectronic IC design and packaging industry.
  • To serve as a booster for talents education and training in PIC technology and a catalyst for advancing the optoelectronic chip industry.
  • To enhance the international reputation of HiSiPIC through international collaboration and high level technology demonstration, further raising Taiwan’s international visibility.
  • To promote the commercialization of R&D results or to establish optoelectronic IC design companies through technology transfer to accelerate the establishment of a complete industrial chain for optoelectronic chip industry.

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